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Category : Electrical and electronic equipment & instrumentations > Measuring instruments
AutoPoint II analysis measurement system
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AutoPoint II is a fixtureless, gridless flying probe with a unique power off impedance analysis measurement system. Capable of detecting manufacturing and in-service faults as standard the measurement system is not limited to a single technique. With the addition of the MiniScanner a wide range of complimentary instruments, whether from DiagnoSYS or an IEEE/GPIB interface instrument supplier, can be added and fully supported by the TestVue32™ operating software.
AutoPoint II is fast, accurate and requires very little maintenance thanks to the use of an advanced linear motion system. Closed loop positioning, high-resolution optics and sophisticated self generation software all add to the appeal of AutoPoint for a diverse range of uses including:
- First-off verification - Pre design maturity Low volume high product mix - Manufacturing defects Volume repair - A test area of 530mm (21") x 530mm (21") is available, - with an overall PCB size of 600 x 600mm. The AutoPoint II requires minimal set-up skills whether using the extensive CAD import utilities or manually positioning the probes to the required test position whilst viewing a high-resolution colour camera image of the point of contact on screen.As a moving probe based system AutoPoint is able to test boards with design features which would be impossible to test utilizing existing bed-of-nails technology.
No constraints are made on component lead spacing or off grid designs and this flexibility makes a fixtureless approach the ideal solution for screening and testing low volume boards. Utilising the TestVue32™ software, component signatures are analyzed on unpowered boards.
This method is non-destructive; it will not damage the device under test or any other component within the circuit. The technique tests the actual pin junctions of active devices as well as values of inductance, resistance and capacitance. It is therefore able to detect leakage and bonding problems at the device as well as shorts and opens, components of incorrect polarity and those of the wrong value.
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