Category : Semiconductor equipment > Wafer test/inspection and measurement systems

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BLACK STAR™ is a latest development of Zero Width Dicing Technology™ (ZWDT™) for semiconductor wafers of different thicknesses and composition.

Wafer dicing time: 3.5 min
Material: Low-K
Street width: Thickness dependant
HAZ: 0
# of passes required: 1
Micro Cracks: None
Chipping: None
Edge strength: 2 times stronger then conventional dicing
Clean Roam Compatibility: Class 1000 or 10000
Water Cooling: None

LASER
Proprietary Type
WAFER
Wafer thickness - 50µ to 700µ.
Wafer size - 12" max.
Frame: Standard types (8” or 12")
Holding tape: standard low tack
VISION SYSTEM
Two-level Magnification
Optical zoom
Type: Pattern Recognition with
Automatic alignment
MOTION SYSTEM
4 axis direct drive servo platform.
Working area 500 x 500 mm
Maximum axis speed 500 mm/s

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List of all articles in this sub-category Wafer test/inspection and measurement systems

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