CDP Chemical Mechanical Polishing System

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The CDP automatic CMP system provides repeatable nanometer level accuracy for the majority of materials used in current day device fabrication processes. Due to its accuracy, low cost of ownership and ease of use, the CDP automatic polisher offers the ideal environment for CMP and delayering applications.
The CDP Auto allows you to achieve industry standards of control and layer removal for traditional CMOS technology, chemical mechanical polishing applications, such as STI and Damascene (acceptable WTWNU and WIDNU are achievable)
The programmable control panel can store up to 100 separate material process routes, with the ability to automatically start any given task on the completion of a previous route - this allows for greater flexibility and automation. Automated, repeatable planarizing and delayering of IC's, multiple/individual die and wafers up to a maximum of 8"ø can be carried out by scrolling through purpose designed control screens.
Available in two different sizes, the wafer/die carrier is suitable for carrying wafers with a maximum diameter of either 4" or 8" respectively. Once the wafer has been attached to the carrier, the desired level of load can be set using the easily operated joystick controls. Back pressure can be applied to the wafer in a similar manner with a maximum setting of 36psi (this may vary depending on the model) helping ensure an even level of polish over the face of the wafer.

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