Category : Machine tools, cutting, molding, machines, precision machining > Laser machining systems

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The JPSA ChromaDice™ system provides a new advance in wafer scribing. The JPSA wafer scribing system, using UV-DPSS lasers at 266nm or 355nm wavelengths, gives you very narrow cut widths (as small as 2.5µm kerf) and unmatched throughput of up to 8 wafers per hour. Excellent die yield of 97%- 99%, and better than 99% system up-time make the investment pays for itself in a matter of months. At a low operating cost of <$2 per wafer, and with the JPSA automatic wafer alignment process (less than one minute to align the wafer), the ChromaDice system introduces a new level of wafer scribing productivity.

The JPSA SystemControls 32 software seamlessly integrates all laser system functions with an easy-to-use GUI interface. The system features Industrial grade reliability with R&D flexibility and comes standard with user-friendly Windows™ based control software

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- IX-500 Laboratory Excimer Workstation
- IX-200 ChromaDice™ UV diode-pumped solid-state Laser system
- IX-1000 ChromaLift™ Laser System
- IX-100 UV Laser System

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List of articles in this sub-category

- Dual Head Laser Deflashing Machine
- LCS 300 Laser Cutting System
- LSS 800 Laser Stencil System
- LGS 200 A Laser Grinding System
- LaserTape UV Tape for the Laser Dicing Process
- LDS 200 A Laser Dicing System

List of all articles in this sub-category Laser machining systems

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