Category : Semiconductor equipment > Wafer/diode die separation equipment

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After processing, the die need to be prepared for easy, accurate pick and placement. The DXE-Expander is engineered to integrate your equipment into that process. It mounts tape to hoop sets, uses hoop sets to expand the tape, and expands die evenly so that pick and place becomes a seamless process.

This system provides an easy and efficient way to mount tape on to hoop sets in preparation for the die separation process. The DXE Expander is used to expand the tape to create equal and parallel spaces between singulated die
Expanding your Wafer. To expand singulated wafers, place the wafer on the DXE and a new outer hoop in the lid of the unit. The lid is lowered and then raised. The new outer hoop has replaced the previous one. The tape is omnidirectionally stretched. This process may be repeated until desired expansion is achieved

List of all articles from this supplier

- Specialty Solvents designed to de-bond adhesives and clean wafers
- DXL Injector
- DXB Bonder
- GST Scriber/Breaker

List of all articles from this supplier

List of articles in this sub-category

- Specialty Solvents designed to de-bond adhesives and clean wafers
- DXL Injector
- DXB Bonder
- GST Scriber/Breaker

List of all articles in this sub-category Wafer/diode die separation equipment

List of all articles in this sub-categoryList of all articles in this sub-categoryList of all articles in this sub-category