Category : Semiconductor equipment > Wafer/diode die separation equipment

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The Dynatex DXL Injector introduces KerfAid Lubricant into the cutting water stream during a wafer saw dicing or other processing operation that uses a continuous water supply.

The DXL Injector provides a regulated stream of a pre-mixed KerfAid to DI water ratio into the saw’s water feed. Dilution factors are adjustable, up to 100:1. The DXL Injector easily retrofits to any dicing saw and requires minimal installation or operation effort, with the ability to run multiple saws depending on saw type/model and blend ratios

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- Specialty Solvents designed to de-bond adhesives and clean wafers
- DXB Bonder
- DXE™ Expander
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List of articles in this sub-category

- Specialty Solvents designed to de-bond adhesives and clean wafers
- DXB Bonder
- DXE™ Expander
- GST Scriber/Breaker

List of all articles in this sub-category Wafer/diode die separation equipment

List of all articles in this sub-categoryList of all articles in this sub-categoryList of all articles in this sub-category