Category : Semiconductor equipment > Wafer/diode die separation equipment

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The GST equipment is automated using a Windows™ NT interface, ensuring consistency and speed. Once the test wafer or laser bar is calibrated, production wafers move quickly through the process with little production support. Within seconds of proper alignment, the GST processes the wafer or laser bar and is ready for more in a 24/7 production environment

List of all articles from this supplier

- Specialty Solvents designed to de-bond adhesives and clean wafers
- DXL Injector
- DXB Bonder
- DXE™ Expander

List of all articles from this supplier

List of articles in this sub-category

- Specialty Solvents designed to de-bond adhesives and clean wafers
- DXL Injector
- DXB Bonder
- DXE™ Expander

List of all articles in this sub-category Wafer/diode die separation equipment

List of all articles in this sub-categoryList of all articles in this sub-categoryList of all articles in this sub-category