Category : Laser components, systems, equipment and applications > Laser components and systems

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The JPSA ChromaLift™ system provides a new advance in GaN-based LED device fabrication. LED devices can be lifted off the sapphire (or SiC) substrate onto a more practical carrier substrate, such as silicon. This process provides for improved device performance; improved heat sinking and thermal management; new extended packaging options; and new electrical connect schemes. Liftoff completely eliminates the need for traditional scribe & break die separation.

The uniform large-area homogenized beam produced by the JPSA ChromaLift™ system results in strain-free die liftoff over large areas. The JPSA liftoff process operates at low ambient temperatures in most cases, so wafer handling is safe and simple. The system operates in a “fire on the fly” mode, allowing liftoff of complete wafers in seconds, rather than minutes.

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List of all articles in this sub-category Laser components and systems

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