Category : Machine tools, cutting, molding, machines, precision machining > Laser machining systems

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The LDS 200 A is a fully automatic, cassette-to-cassette machine including fast quality check (control of kerf width, position and roughness).

Axes Working area 240 x 240 mm
Maximum stroke (X x Y) 600 x 400 mm
Accuracy ± 3µm
Repeatability ± 1µm
Maximum axis speed 1000 mm/s
Maximum acceleration 20 m/s2
Laser Solid state Nd:YAG, pulsed
Wavelength 532 or 1064 nm
Power 100 W
Water pump Water pressure 20 to 500 bars
Nozzle diameter 30µm, 35µm, 40µm, 50µm, 60µm, 75µm or 100µm
Workpiece Wafer size 25 to 203 mm
(1” to 8”)
Cleaning High pressure cleaning
Megasonic water jet cleaning
Front and back side drying
Loading Maximum of 3 cassettes (6” or 8”)
Dimension Dimension (W x D) 1560 x 1100 mm
& Weight Weight 950 kg

List of all articles from this supplier

- LCS 300 Laser Cutting System
- LSS 800 Laser Stencil System
- LGS 200 A Laser Grinding System
- LaserTape UV Tape for the Laser Dicing Process

List of all articles from this supplier

List of articles in this sub-category

- Dual Head Laser Deflashing Machine
- LCS 300 Laser Cutting System
- LSS 800 Laser Stencil System
- LGS 200 A Laser Grinding System
- LaserTape UV Tape for the Laser Dicing Process
- Laser cutting

List of all articles in this sub-category Laser machining systems

List of all articles in this sub-categoryList of all articles in this sub-categoryList of all articles in this sub-category