Category : Machine tools, cutting, molding, machines, precision machining > Laser machining systems

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LGS 200 A is a fully automatic laser edge-grinding system, targeted to edge-grinding of thin wafers. Advanced process capabilities to reduce wafer breakage due to micro-cracks at the edge of the wafer.
The Laser-Microjet is able to laser-grind the wafer edge in minimal time without damage
Any contour of the edge is possible
Very fast process: optimal cutting speeds between 50 mm/s and 200 mm/s
Easy reciepe change leads to a very flexible process
Negligible mechanical stress; force free
Negligible chipping
Negligible mechanical damages
Laser-grinding of any edge profile possible
Machine can also be utilized for drilling, scribing, grooving, dicing, thinning, marking of untapped wafers
Flat-or notch cutting possible
Ldeal for thin wafers
Optimal wafer thicknesses between 25 microns – 300 microns
No tool-wear
Very few consumables, low running costs
Reduced cost of ownership compared to traditional grinding methods
Laser-class-1 machine with full enclosure
Change of wafer size (for example 6”to 8”) possible without any modification

List of all articles from this supplier

- LCS 300 Laser Cutting System
- LSS 800 Laser Stencil System
- LaserTape UV Tape for the Laser Dicing Process
- LDS 200 A Laser Dicing System

List of all articles from this supplier

List of articles in this sub-category

- Dual Head Laser Deflashing Machine
- LCS 300 Laser Cutting System
- LSS 800 Laser Stencil System
- LaserTape UV Tape for the Laser Dicing Process
- LDS 200 A Laser Dicing System
- Laser cutting

List of all articles in this sub-category Laser machining systems

List of all articles in this sub-categoryList of all articles in this sub-categoryList of all articles in this sub-category