Category : Semiconductor equipment > Wafer dicing machines

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The LSD-110 employs a "break bar" that spans the entire scribe line. The break bar is shaped such that it bends the cantilevered wafer over the edge of a mandrel and applies tensile strain lateral to the scribe line. It is the shape of the break bar that controls the strain placed on the scribe.

Full Contact Dicing
Applying breaking pressure to a scribed wafer over the surface of the wafer. For use with Detectors, optical filters and light emitting diodes.

List of all articles from this supplier

- Scribe Tools (for Loomis scribers only)
- LSD-100 scribe dicing machine
- Automated Roller Breaker
- LSD-150 scribe dicing machine

List of all articles from this supplier

List of articles in this sub-category

- Scribe Tools (for Loomis scribers only)
- LSD-100 scribe dicing machine
- Automated Roller Breaker
- LSD-150 scribe dicing machine

List of all articles in this sub-category Wafer dicing machines

List of all articles in this sub-categoryList of all articles in this sub-categoryList of all articles in this sub-category