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Category : Machine tools, cutting, molding, machines, precision machining > Laser machining systems
Laser Cutting
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Fully integrated test functions for fast and accurate measurement Patented beam calibration and powerful vision system for precise, efficient beam positioning VersiTrim™ software for easy application programming and automation integration VXI architecture with GPIB and other interfaces for custom instrumentation Advanced diode-pumped laser processing in IR or green wavelengths for demanding applications
| Laser Wafer Marking | Laser Circuit Trimming | Laser 3-D optical inspection | | Laser Wafer Repair | Laser Wafer IC Trimming |
Fully integrated test functions for fast and accurate measurement Patented beam calibration and powerful vision system for precise, efficient beam positioning VersiTrim™ software for easy application programming and automation integration VXI architecture with GPIB and other interfaces for custom instrumentation Advanced diode-pumped laser processing in IR or green wavelengths for demanding applications
| Laser Wafer Marking | Laser Circuit Trimming | Laser 3-D optical inspection | | Laser Wafer Repair | Laser Wafer IC Trimming |
The Solid State YAG JK Lasers and Spectron lasers are used to cut metals, some ceramics, a few plastics, and graphite composites. The eCO2 lasers address thin metal, paper, wood, plastic, fabrics, and other non-metal cutting applications.
Cutting requires that the laser beam is focused by a lens to a small focus spot, typically in the 25-100um diameter range for fine cutting and 100um to 300um range for thicker section cutting. Coaxial gas is delivered just above the focus by a nozzle that surrounds the beam to keep the optics clean and improve the cutting process. Gases such as oxygen and air are used to promote cutting of ferrous alloys and cellulose materials. Air is often used with plastics and fabrics. High-pressure inert gas is used when cutting some metals to leave an un-oxidized edge with little dross.
Pulsed YAG lasers are used for fine to heavy section cutting with the Spectron SL Series used for kerf widths down to about 25um and thicknesses up to approx. 2mm. The pulsed JK Lasers have kerf widths down to about 100um and cut thicknesses up to over 25mm. CW and Super Modulated JK Lasers can cut with kerf widths in the 250-300um range and cut at high speeds in metals up to 10mm.
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- YAG lasers
- Lsc optical system
- M2 Galvanometer
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List of articles in this sub-category
- Dual Head Laser Deflashing Machine
- LCS 300 Laser Cutting System
- LSS 800 Laser Stencil System
- LGS 200 A Laser Grinding System
- LaserTape UV Tape for the Laser Dicing Process
- LDS 200 A Laser Dicing System
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of all articles in this sub-category Laser machining systems
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