Category : Machine tools, cutting, molding, machines, precision machining > Laser machining systems

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Applicability:
This document provides the General Guidelines and Considerations for the laser scribing of ceramic substrates that are typically used in the manufacture of Microelectronic Circuits and Multichip Modules. The specifications and tolerances given will generally produce the MOST COST EFFECTIVE design approach. Tighter tolerances may be achieved at increased cost and leadtime.

Purpose of scribing:
Scribing makes possible the cost effective manufacture of arrays (multiple ceramic parts) that may be then singulated by breaking them apart. Scribing also provides a cost effective means of improving part quality by allowing the removal of the outside borders that contain defects such as rough or non-parallel edges.

Types of materials scribed :
Typical materials scribed are thin, flat substrates of Alumina, Beryllia, and Aluminum Nitride. Please call the Accu-Tech factory directly for technical information on other special materials that may be scribed.

General material characteristics:
Alumina 96%
- Most commonly used in Microelectronics.
- Represents over 90% of the volume manufactured.
- Excellent overall substrate material for cost effective manufacturing and laser processing.
Alumina 99+ %
- Similar to 96% but typically provides a superior surface finish for fabricating Thin Film circuitry.
Beryllia BeO
- Typically used for its superior heat conductivity. Beryllia requires special handling and safety precautions due to the potential toxicity of the dust produced during cutting, grinding, drilling, or breaking operations.
Aluminum Nitride
- Roughly equivalent in heat conductivity to BeO but the safety issue is avoided. Call Accu-Tech for additional information on this material.

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- Laser drilling & machining of ceramic substrates
- Precision laser cutting

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- Dual Head Laser Deflashing Machine
- LCS 300 Laser Cutting System
- LSS 800 Laser Stencil System
- LGS 200 A Laser Grinding System
- LaserTape UV Tape for the Laser Dicing Process
- LDS 200 A Laser Dicing System

List of all articles in this sub-category Laser machining systems

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