Category : Machine tools, cutting, molding, machines, precision machining > Laser machining systems

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Synova, the inventor of the water- jet-guided laser (Laser MicroJet®) has developed a new tape, which can be used to retain the singulated parts during the laser cutting.

The paramount application of the LaserTape® is in the semiconductor industry, where the Laser MicroJet® is used for the singulation of Silicon wafers into chips.

The LaserTape® will revolutionize the laser cutting of small parts. In fact, the conventional laser would burn any type of tape.

Only the water- jet-guided (and cooled) laser, together with the specially developed LaserTape® is able to fix the work pieces in a reliable way.

List of all articles from this supplier

- LCS 300 Laser Cutting System
- LSS 800 Laser Stencil System
- LGS 200 A Laser Grinding System
- LDS 200 A Laser Dicing System

List of all articles from this supplier

List of articles in this sub-category

- Dual Head Laser Deflashing Machine
- LCS 300 Laser Cutting System
- LSS 800 Laser Stencil System
- LGS 200 A Laser Grinding System
- LDS 200 A Laser Dicing System
- Laser cutting

List of all articles in this sub-category Laser machining systems

List of all articles in this sub-categoryList of all articles in this sub-categoryList of all articles in this sub-category