Category : Machine tools, cutting, molding, machines, precision machining > Laser machining systems

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EUV microstepper with 35nm resolution and 0.6mm x 0.2mm field will speed experimentation on EUV resists and technologies, extending the record of these tools for early lithography learning.

The semiconductor industry uses microsteppers to gain early learning on new technology nodes four to five years ahead of their introduction. These tools use a reduced image field at an optical resolution similar to that eventually intended to be adopted in production. Microsteppers allow manufacturers and researchers alike to develop and qualify new photoresists (and other technologies) well ahead of when they would be required for volume IC manufacturing. For example, the 157nm, 0.85NA, 15x reduction, 0.7mm field Exitech MS-157 microstepper at the Resist Test Center of International SEMATECH (ISMT) has processed an average of 50 wafers and 5-15 resist formulations a day sinceJune 2000.

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- Tools for the cutting of ceramics, metals and silicon
- Thin Metallic Layers
- TCO Patterning
- MicrAblater™ M2000 laser micromachining tool

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- Dual Head Laser Deflashing Machine
- LCS 300 Laser Cutting System
- LSS 800 Laser Stencil System
- LGS 200 A Laser Grinding System
- LaserTape UV Tape for the Laser Dicing Process
- LDS 200 A Laser Dicing System

List of all articles in this sub-category Laser machining systems

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