Category : Machine tools, cutting, molding, machines, precision machining > Precision metal parts and tooling solutions

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World-leading stencil manufacturer, Tecan, is ramping up production of its multi-level stencils to meet increasing demand from PCB builders who are increasingly recognizing the cost benefits they bring by substantially reducing the need for post-print rework, in both traditional and lead-free production facilities.

Key to the success of any solder paste print process is the deposition of exactly the right volume of paste to each and every pad. This is increasingly difficult using traditional stencils as printed circuit boards become more complex and typically contain a wide variety of different size and pitch components - each with their own paste volume and coplanarity requirements. To minimize rework, it is necessary to ensure that the appropriate paste volumes are deposited for all components, from power and I/O connectors to discretes and fine-pitch devices of all types, in a single squeegee pass.

The Tecan multi-level stencil is critical in delivering exactly the required amount of paste to each pad. Fundamentally, this is achieved by controlling the thickness of the stencil in selective areas across its surface, local to each component, so that apertures in the thinner areas deliver less paste and apertures in the thicker areas deliver more paste. In addition to delivering the ideal paste deposit, the technique avoids the problems associated with traditional attempts to selectively increase paste deposits by increasing the size of apertures in the X or Y axes, which can result in pad proximity problems such as short circuits.

Increasingly, PCB manufacturers are realizing the significant cost savings that can be made by minimizing post-print rework - through optimizing the print process itself - by employing the proven multi-level stencil.

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List of articles in this sub-category

- Tecan releases four software packages that unite to integrate your data
- Board-level RFI screening technology cuts assembly time - by 80%
- Rework stencils deliver repeatable accuracy - Tecan
- PEF sieves ensure 100% of material is accounted for
- TECAN introduces Multi-level evaporation masks are robust and accurate
- Cost-effective process delivers burr and stress free metal parts

List of all articles in this sub-category Precision metal parts and tooling solutions

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