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Irvine, California – June 11, 2004 – Newport Corporation announced its latest product offering with the introduction of eutectic assembly into "TO Packages" on the MRSI-605 Advanced Packaging Die Bonder. Transistor Outline Packages or "TO Packages" commonly called TO Cans or TO Headers are a popular package style for photonics applications.

Material handing of TO Packages is fully automatic. Features of the eutectic work stage include automatic clamping and rotation for placing die on perpendicular surfaces. This flexible system supports direct gold/silicon eutectic and eutectic reflow using gold/tin and gold/germanium preforms. The system uses programmable closed loop temperature control, programmable up to 500°C.

The Newport MRSI-605 can place die with an inverted pyramid collet and simultaneously scrubs (variable amplitude and frequency) to accomplish eutectic reflow. A heated cover gas of H2 N2 mixture is blanketed over the hot plate.

Other advanced features include advanced machine vision and a thermally and mechanically stable machine platform that delivers 10 micron placement accuracy. The system’s "feather touch" force control, combined with closed loop force feedback provides the ability to handle delicate devices without damage to internal features, such as GaAs and InP devices. Material presentation methods include waffle pack, Gel-Pak, wafer and feeders.

The MRSI-605 AP is targeted to end users in the semiconductor and electronic packaging markets, including manufacturers of photonics, MEMS, multi-chip modules, hybrids, microwave & RF circuits, and advanced semiconductor packages.

More information on Newport’s semiconductor equipment is available on the company’s Web site at www.newport.com/apas.

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