|
Category : Fiber optics components, systems, photonic instrumentation > Fiber optic systems (automated alignment, assembly and packaging systems)
Newport Introduces Advanced Feature Alignment to MRSI-605 Die Bonder
Newport Introduces to MRSI-605 Die Bonder
Irvine, California – May 21, 2004 – Newport Corporation has added "advanced feature alignment" to its MRSI-605 Advanced Packaging Die Bonder, enabling components to be placed with 10 micron accuracy relative to features or fiducials in both X and Y axes. This improvement in placement accuracy, achieved through enhancements in lighting, software and vision, delivers the capabilities required for ultra precision assembly.
The MRSI-605 AP is targeted at end users in the semiconductor and electronic packaging markets, including manufacturers of MEMS, advanced semiconductor packages, multi-chip modules, military & defense hybrids, microwave & RF circuits and photonics packages. For photonics, it enables complex alignments, such as the XY placement of a die relative to the center of a TO header, and the angular placement relative to a previously placed component. For microwave devices, a die can be simultaneously placed relative to a neighboring substrate in the X direction and an adjacent die in the Y direction. Many applications such as placing MMIC die along microwave transmission lines and aligning laser die features relative to the optical path will benefit from this advancement.
The system operates with ICON based Windows software, which provides extensive functionality and flexibility. New vision tools such as an adjustable region of interest, enhanced gain control and filters, and 360 degree pattern matching enable vision processing of the most challenging substrate and die materials. Programmable lighting ensures proper contrast for the image. Advanced vision provides the ability and flexibility to align to both top and bottom features.
The system’s "feather touch" force control, combined with closed loop force feedback provides the ability to handle delicate devices without damage to internal features, such as GaAs and InP devices. Material presentation methods include waffle pack, Gel-Pak, wafer and more.
More information on Newport’s semiconductor equipment is available on the company’s Web site at www.newport.com/apas.
Article from Newport Corporation
List of all articles from this supplier
- Newport Corporation Introduces the SolaryX™ 420 Thin Film Photovoltaic Laser Scribing System
- Newport Introduces the SmartTable® OTS™ Optical Table System
- Newport Introduces the 1936-C and 2936-C Benchtop Optical Power and Energy Meters
- Newport’s Agilis range of piezo-driven devices continues to grow
- Newport Expands Family of Ultra-Narrow Linewidth, Tunable Ring Lasers with the New Spectra-Physics Matisse™ TX
- Newport Announces the Spectra-Physics Pulseo™ High Peak Power UV Laser
List of all articles from this supplier
List of articles in this sub-category
- Fibre-optic termination system
- MFD-1000 fiber test system
- Ctc fiber polisher for connectors termini & contacts
- TP-125MK-III automatic fiber optic cleaner
- Cleave-Chek Interferometer System
- Interferometric microscope designed for measuring the endface of fiber optic surfaces
List
of all articles in this sub-category Fiber optic systems (automated alignment, assembly and packaging systems)
List of all articles in this sub-categoryList of all articles in this sub-categoryList of all articles in this sub-category
|