Category : General industrial equipment, special machines > Assembly systems

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FINEPLACER® Pico AMA is an innovative automatic micro assembler that offers users extreme modularity and flexibility. Because the system is based on a modular platform, it offers a high range of flexibility and can be applied to a wide application range. Additionally, the ability to upgrade and retrofit provides significant cost benefits to users - it provides an “all in one” cost-saving solution.

With a high placement accuracy of 5 µm with 3 sigma, the FINEPLACER® Pico AMA is ideal for the advanced placement and bonding of optoelectronic components, MEMS, multichip modules, sensors, RFID mounting, and more. The system is versatile for many bonding techniques, including flip chip (thermocompression, ultrasonic, and soldering), dispensing, UV curing, fluxing, ACF and ACP. Picture processing, self-propelled positioning table and placement arm as well as automatic force generation allow the system to bond numerous, like components continuously, resulting in throughput improvement.

The FINEPLACER® Pico AMA is operator independent – providing stability and increased process safety for a production environment

List of all articles from this supplier

- Fineplacer® Pico MA base module
- Split Field Optics mirage 96
- Mirage Video Imaging System
- Fineplacer® CRS 10 rework station

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List of articles in this sub-category

- Final Assembly for Turn-Key Facilities
- Rotary assembly systems
- Linear transfer systems
- Flexible assembly solutions
- Dynamic Assembly System designed for stepwise automation
- Automatic sliding-roof installation

List of all articles in this sub-category Assembly systems

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