Category : Semiconductor equipment > Wafer test/inspection and measurement systems

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Each semiconductor wafer is manufactured with hundreds of devices on them. The spaces between the rows and columns of these devices are called “streets”, and in these “streets” are strategically placed test devices called process control monitors. Probing these process control monitors and testing their performance during the production process, allows both manufacturing process parameters and wafer quality to be optimized. Cascade’s patented Pyramid Probes have the unique ability to contact extremely small process control devices enabling semiconductor wafer designers to reduce the size of the inter-die “streets” and thereby increase the number of die that can be fabricated per wafer. Such capability can enable a density increase resulting in 7% or more die per wafer – a significant increase in revenue per manufacturing cycle.

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- Pyramid Probes for Large Scale ICs
- RFC Pyramid Probe Edge Series
- Pyramid Probes for High-Speed Digital Applications
- Pyramid Probes for RF Applications

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- nHance CMP system for failure analysis
- WSB2 Wafer Substrate Bonding Unit
- Blackstar: Silicon Dicing System for semiconductor wafers
- FabExpress™ designed to handle 200mm to 300mm Semiconductor Wafers
- Viper 2430 Automated macro-defect inspection system
- Surfscan SP1 DLS surface inspection system

List of all articles in this sub-category Wafer test/inspection and measurement systems

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