|
Category : Semiconductor equipment > Wafer test/inspection and measurement systems
Pyramid Probes for Large Scale ICs
|
|
 |
| PRINT |
|
 |
| BACK |
|
The LSI Pyramid Probe Card allows at-speed test of large scale ICs at die sort. Low-inductance power and ground contacts and controlled-impedance signal lines provide electrical performance exceeding that of most available IC packages. At-speed die sort reduces package scrap and allows shipment of Known-Good Die (KGD).
Article from Cascade Microtech,
List of all articles from this supplier
- Pyramid Probes
- RFC Pyramid Probe Edge Series
- Pyramid Probes for High-Speed Digital Applications
- Pyramid Probes for RF Applications
List of all articles from this supplier
List of articles in this sub-category
- nHance CMP system for failure analysis
- WSB2 Wafer Substrate Bonding Unit
- Blackstar: Silicon Dicing System for semiconductor wafers
- FabExpress™ designed to handle 200mm to 300mm Semiconductor Wafers
- Viper 2430 Automated macro-defect inspection system
- Surfscan SP1 DLS surface inspection system
List
of all articles in this sub-category Wafer test/inspection and measurement systems
List of all articles in this sub-categoryList of all articles in this sub-categoryList of all articles in this sub-category
|
