Category : Semiconductor equipment > Wafer test/inspection and measurement systems

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S-7840 Defect Review and Process Evaluation SEM

The S-7840 can be used for critical dimension measurement, for variable angle viewing, defect review and optional EDX microanalysis.
A new high-performance objective lens, combined with a stable Schottky emission electron source, allows for a high imaging resolution of 4 nm and a high wafer tilt angle of up to 60 degrees.
The flexible loader design offers the ability to load reticles and masks up to 6" size.

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List of all articles in this sub-category Wafer test/inspection and measurement systems

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