Category : Semiconductor equipment > Wafer test/inspection and measurement systems

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The Shallow Probe model LEXFAB-300 is a turnkey system designed to meet the needs for fully automated semiconductor fab application at the 90nm node and beyond.
The LEXFAB-300:
- gives Elemental Concentration AND Thickness of thin films, layers or ULE implants.
- is designed for Product Wafer analysis (measurement area from 5µm to 100µm) including enhanced Pattern recognition.
- is fully compatible with SMIF 200mm, Open Cassette 200mm and FOUP 300mm standards. SECS/GEM automation.
- meets factory-required host communication protocols. Fully compliant with SEMI standards.
- provides Full Wafer Analysis and Mapping (concentration and thickness uniformity).
- is based on a Non-destructive technique.
- allows a high throughput.
- guarantees a high uptime, reliability and stability, ensuring documented long term tool matching.
- has an easy-to-use User Interface with dedicated recipes

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List of all articles in this sub-category Wafer test/inspection and measurement systems

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