Category : Semiconductor equipment > Wafer test/inspection and measurement systems

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The Surfscan SP1 DLS captures yield-limiting defects across all process modules - lithography, CMP, etch, and films - and also enables tool-qualification and tool monitoring in 0.13 µm design rules and below.Capturing defects is only the first part of defect control. Another critical component is the ability to identify sources of defects quickly so the problem with the process or equipment can be resolved with minimum yield impact. This requires efficient and effective defect review, classification, and analysis. KLA-Tencor delivers an overall solution through the most comprehensive range of defect reduction and control technology available. This includes optical and e-beam inspection systems; a UV reticle inspection system that ensures capture of all defect types; automated defect review and classification systems; and data analysis products that manage, correlate, and integrate the wealth of defect data and images from these and other tools.

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- Viper 2430 Automated macro-defect inspection system
- Archer XT+ optical metrology solution
- Surfscan 6420 surface inspection tool
- 300 UV wavelength reticle inspection system

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List of articles in this sub-category

- nHance CMP system for failure analysis
- WSB2 Wafer Substrate Bonding Unit
- Blackstar: Silicon Dicing System for semiconductor wafers
- FabExpress™ designed to handle 200mm to 300mm Semiconductor Wafers
- Viper 2430 Automated macro-defect inspection system
- Surfscan 6420 surface inspection tool

List of all articles in this sub-category Wafer test/inspection and measurement systems

List of all articles in this sub-categoryList of all articles in this sub-categoryList of all articles in this sub-category