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Category : Semiconductor equipment > Wafer test/inspection and measurement systems
Tight thickness tolerance wafers
Features:
Addresses tolerance budget packaging designs.
Allows "design in" of exact optical paths.
Suitable for close distance lithographic scanning.
Tight Thickness Tolerance ±3 µ
Thickness > 300 µ
Diameters < 200 mm; 8’.
Borosilicate, soda lime glass.
Article from Anteryon B.V.
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