Category : Semiconductor equipment > Wafer test/inspection and measurement systems

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The 24xx series combines with other inspection systems to form a PCM (photo cell monitor) strategy that combines backside inspection, photo cell monitoring (PCM), after-develop inspection (ADI) for macro and micro defects, and image qualification for control of reticle defects. This solution delivers significant improvements in defect detection and allows fabs to correct litho process excursions more quickly. Enables capture of macro and random defects such as hot spots and coating, whole-wafer defects such as no-coat, no-develop, and tilted reticles.
Allows fast and accurate re-work/scrap decisions.
Features inline (run-time) binning for performing root-cause analysis, reducing time to correction, and achieving accurate process control.
Allows rapid dispositioning through individual defect images, wafer maps, wafer images, and galleries of maps.
Features full compliance with I300I standards for complete integration and rapid deployment in 300 mm fabs

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List of all articles in this sub-category Wafer test/inspection and measurement systems

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