Category : Semiconductor equipment > Wafer test/inspection and measurement systems

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Bonding techniques for processing thin and fragile II-VI and III-V semiconductor wafers, along with geological thin section and other materials require delicate handling procedures. Laboratories bonding such materials need to maintain the highest quality of sample yield and minimise breakage of the materials in the preparation process.

Key Features
• Automated process cycle minimises operator input
• Excellent wafer to support disc parallelism
• Touch button control of bonding parameters
• 102mm (4") or 152mm (6") wafer capacity
• Single or multiple wafer capacity

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List of all articles in this sub-category Wafer test/inspection and measurement systems

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