Category : Semiconductor equipment > Semiconductor components and instrumentations

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The first to introduce a fully-automatic infeed rotary surface grinder for semiconductor wafers, Strasbaugh continues its leadership with the unique nTellect Wafer Grinder.

nTELLECT BENEFITS
Reduced sub-surface damage
Improved surface finish
Repeatable thickness control
High volume wafer throughput
Low cost

nTELLECT TECHNOLOGIES
Tapeless Backgrinding
In-feed technology
In-situ thickness control
Force adaptive grinding
Linear traversing grind spindles
Automated process control
Thin wafer handling

nTELLECT APPLICATIONS
Tapegrated Circuit Backgrinding
SOI (Silicon on Insulator)
Prime Wafers
GaAs (Gallium Arsenide)
LiNbO3 (Lithium Niobate)
AlTic (Aluminum Titanium Carbide for Read/Write Heads)
Glass
Sapphire
Quartz

REDUCED SUB-SURFACE DAMAGE
Strasbaugh's innovative nTellect Grinder incorporates near-frictionless, force-sensitive infeed mechanics with an intelligent control system. Rather than force-feeding the grinding wheels at fixed feed rates, nTellect's force adaptive, infeed system design allows the grinding wheel dynamics to determine the precise stock removal rate. This increases wafer strength and reduces wafer breakage.

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- Polycrystalline ingots
- HB poly GaAs
- Lütze Semiconductor Relay Modules
- Dynamic I-V analyzer

List of all articles in this sub-category Semiconductor components and instrumentations

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